PEGATRON Brings AI Infrastructure from Design to Deployment at OCP Global Summit 2026

SAN JOSE, Calif., Oct. 14, 2026 /PRNewswire/ -- PEGATRON, a globally recognized provider of comprehensive AI infrastructure and server solutions, will showcase its capabilities in developing and manufacturing next-generation AI infrastructure at OCP Global Summit 2026. Under the theme "Scaling Innovation for the AI Era," Pegatron will demonstrate how advanced AI platforms can be transformed into production-ready systems, racks, and clusters for rapid deployment in data centers.

As AI infrastructure scales from individual servers to large-scale clusters, successful deployment requires more than compute performance. It requires system-level engineering, liquid cooling, power architecture, open standards, manufacturing readiness, and rigorous validation. Pegatron brings these capabilities together through OCP-aligned architectures, including ORv3 busbar, DC-MHS, and OCP 3.0 network adapters, enabling modular and scalable infrastructure for modern data centers. Its OCP-compliant platforms span AI rack solutions, accelerated computing, compute, and storage infrastructure.

At the center of the showcase is the NVIDIA Vera Rubin NVL72, Pegatron's RA4803-72N3, a rack-scale AI platform integrating 72 NVIDIA Rubin GPUs, 36 NVIDIA Vera CPUs, 6th generation NVIDIA NVLink, and fully liquid-cooled rack-level integration. The platform highlights Pegatron's ability to engineer and manufacture complex rack-scale AI solutions and migrate from design to cluster deployment.

Extending beyond accelerated computing, Pegatron will showcase a NVIDIA Vera CPU liquid-cooled system and NVIDIA Groq 3 LPX, addressing the evolving infrastructure requirements of agentic AI. NVIDIA Vera, the CPU for agents, is optimized to execute tool calls, sandboxed code, and reinforcement-learning loops between model steps. Deployed at rack scale, NVIDIA Vera CPU provides dense capacity to run alongside GPU infrastructure, supporting efficient execution, orchestration, and data processing workloads in AI factories. NVIDIA Groq 3 LPX further extends the NVIDIA Vera Rubin platform for highly interactive, latency-sensitive inference.

Pegatron will also feature the AS210-2T1-8H3, a 2U fully liquid-cooled NVIDIA HGX Rubin NVL8 system combining dual Intel® Xeon® 6 processors, AMD EPYC™ 9006 processors, or NVIDIA Vera CPUs with an eight NVIDIA Rubin GPU baseboard. The platform demonstrates high-density system engineering, fully liquid-cooled architecture, and rack-level integration. Its rack-scale configurations include the RA4800-64H3, supporting eight systems and up to 64 GPUs, and the RA4800-72H3, supporting nine systems and up to 72 GPUs in a 48U liquid-cooled rack.

The portfolio also includes AI-ready compute and storage infrastructure powered by AMD EPYC™ 9006 Series processors. Pegatron will showcase the SS201-1A1, a 2U single-socket storage server supporting up to 32 E3.S NVMe SSDs for high-throughput AI data pipelines, alongside the GS203-2A2 and GS205-2A2E 2U dual-socket platforms for enterprise, cloud, HPC, and data-intensive workloads. With up to 256 cores and 512 threads, high memory bandwidth, and PCIe® Gen 6 connectivity, AMD EPYC 9006 processors provide a high-density compute foundation across compute and storage applications. These platforms incorporate OCP 3.0, DC-MHS, and flexible power architectures, including 48VDC busbar configurations for OCP racks.

From digital engineering to factory deployment, Pegatron is extending its AI infrastructure capabilities through NVIDIA DSX AI factory platform-aligned workflows. At its facilities, digital-twin simulation and optimization are connected with physical manufacturing, automated production, thermal validation, and system to rack level run-in testing, helping translate engineering insights into production-ready AI infrastructure.

"A key measure of AI infrastructure is how efficiently it can move from engineering to deployment," said Gary Cheng, President and Co-CEO of Pegatron. "Pegatron combines deep system design expertise with vertically integrated manufacturing, OCP-aligned architecture, and rack-level validation before deployment to rapidly build and deploy AI servers, clusters, and data center infrastructure at scale. By connecting digital-twin simulation, thermal validation, automated manufacturing, and rack-level testing, we help customers move faster from AI infrastructure design to production deployment."

Through its integrated capabilities, Pegatron is enabling AI infrastructure to move beyond individual systems toward production-ready AI clusters and data centers—bringing advanced AI infrastructure from concept and simulation to validated, scalable deployment.

For more information, please visit PEGATRON SVR website and follow us on LinkedIn and YouTube.
Website: https://svr.pegatroncorp.com  
LinkedIn: https://tw.linkedin.com/showcase/pegatron-svr/
YouTube: https://www.youtube.com/@PEGATRONSVR 

About PEGATRON

PEGATRON Corporation (hereafter referred to as "PEGATRON"), with abundant product development experience and vertically integrated manufacturing, is committed to providing clients with innovative design, systematic production, and manufacturing services to comprehensively and efficiently satisfy all our customers' needs.

Drawing on accumulated experience in server design, manufacturing, and deployment, Pegatron focuses on developing a variety of state-of-the-art servers including liquid-cooled/air-cooled server solutions based on x86 and ARM architectures, racks, and AI clusters, that meet the requirements of present and future Cloud Service Providers' data centers, as well as enterprise-grade data centers.

Pegatron Corporation Website: https://www.pegatroncorp.com/